Santa Clara, California--(Newsfile Corp. - March 25, 2024) - Eliyan ("Eliyan") Corporation, credited for the invention of the semiconductor industry's highest-performance and most efficient chiplet interconnect, today announced the closing of its latest funding round, totaling $60 million. The funding was co-led by Samsung Catalyst Fund and Tiger Global Management and includes participation from existing investors, including Intel Capital, as well as SK hynix, Cleveland Avenue and Mesh Ventures, amongst others.
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Key Takeaways:
Eliyan's chiplet interconnect technology achieves up to 4x the performance and half the power of other solutions.
The company's NuLink PHY, proven on advanced process nodes, addresses both Die-to-Die and Die-to-Memory interconnect with its highly efficient performance metrics.
Driven by demand for AI chips, industry forecasters are calling for robust growth in the HBM sector, as much as 331% increase this year, followed by 124% in 2025 (Arete Research)
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About Samsung Catalyst Fund
Samsung Catalyst Fund (SCF) is Samsung Electronics' evergreen multi-stage venture capital fund that invests in deep-tech infrastructure and data-enabled platforms. SCF's sectors of interest span multiple domains including datacenter and cloud, artificial intelligence, networking and 5G, automotive, sensors, quantum computing and beyond. SCF aspires to work closely with brilliant entrepreneurs and disruptive ideas, harnessing our global reach to create value and foster mutual growth and benefits. Among the many advantages our founders enjoy are shared resources, financing, networking, corporate development, and mentorship from SCF's domain experts.
About Tiger Global Management
Founded in 2001, Tiger Global Management, LLC invests in private and public companies across the global Internet, software, consumer, and financial technology industries. Tiger Global's mission is to generate long-term world-class returns for its investors.
About Eliyan
Eliyan Corporation is leading the chiplet revolution, focusing on a fundamental challenge with scaling semiconductor performance, size, power, and cost to meet the needs of high-performance computing applications, from desktop to datacenter. It has developed a breakthrough method to enable the industry's highest performing interconnect for homogenous and heterogenous multi-die architectures using both advanced and standard packaging substrate. To date, the company has received funding from Celesta Capital, Cleveland Avenue, Intel Capital, Mesh Ventures, Micron Ventures, Samsung Catalyst Fund, SK hynix, Tiger Global Management, and Tracker Capital Management. It is based in Santa Clara, California. More information can be found here. www.eliyan.com
Contacts:
Mike Sottak
1 (650) 248-9597
mike@wiredislandpr.com
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